Rigid-flex PCB_One-Stop EMS Provider

Via Processing

Tented Vias Opened Vias Solder Mask Plug (IV-B) Non-Conductive Fill & Cap (VII)

Surface Finish

ENIG OSP Immersion Silver

Gold Thickness

1μ″ 2μ″ 3μ″

TG Rating

TG130 TG150 TG170

PCB Thickness

Pcb Solder Mask

Silkscreen

white black clear

Outer Outer Cu

1oz 2oz 3oz 4oz 5oz 6oz

Inner Cu：

1oz 2oz 3oz 4oz 5oz 6oz

FPC Layer Count

1 2 3 4 5 6

FPC Thickness

0.1mm 0.13mm 0.15mm 0.2mm 0.25mm

Covering Type

Coverlay (1-side) Coverlay (2-sides) Solder Mask (1-side) Solder Mask (2-sides)

Solder Mask

yellow black white clear

FPC Silkscreen

white black clear

Material

Adhesive ED Adhesiveless ED Adhesive RA Adhesiveless RA

PI Thickness

12.5um 25um 50um

Outer Cu

1/3oz 0.5oz 1oz

Forming Method

Laser Forming Mold Forming

Stiffener Type

Not Required Stainless Steel Stiffener Aluminum Stiffener FR4 Stiffener PI Stiffener

Adhesive Backing

Not Required Required

EMI Shielding Film

Not Required Low R (1-side) Low R (2-sides)

Edge Plating

No Yes

Blind/Buried Vias

No Yes

Impedance Control

No Yes

Plated Half-holes

No Yes

Conductive Adhesive

No Yes

Electrical Test

100% FPT for Batches Test Fixture

If Data Conflicts

Follow Order Parameters Follow Files Ask for Confirmation

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