| Project | Standard | Economy |
|---|---|---|
Welding Surface: | Single-sided Welding (SMD + Through-hole) | Single/Double-sided Welding (SMD + Through-hole) |
| Number of floors: | 2, 4, 6 floors; | unlimited |
| Plate thickness range: | 0.8mm - 1.6mm | unlimited |
| Size: | 10*10mm - 470*570mm | 70*70mm - 460*510mm |
| Quantity: | Prototype (≤30(50) large pieces) | Minimum 2 pieces per order, no upper limit |
| Pad plating: | With restrictions | No restrictions |
| PCB Color: | With restrictions | No restrictions |
| PCB Shipping Methods: | Single board, perforated sheeting | Single board, perforated sheeting, V-cut sheeting |
| Process edge: | Not required | Must be included |
| Mark point: | Not required | Required |
| SPI solder paste test: | No | Yes |
| AOI: | None | separate inspection |
| Minimum Encapsulation: | 0402 | 0201 |
| Minimum packaging: | 0402 | 0201 |
| Minimum IC pin spacing: | 0.4mm | 0.35mm |
| BGA ball pitch: | 0.5mm | 0.3mm |
| Reflow soldering temperature: | 255 +/- 5 degrees (non-adjustable) | 240 +/- 5 degrees |
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