| Subject | Type（FR-4） |
|
|
| Manufacturing Capability |
| Finished Product | No. of Layer |
|
|
| 1-40 Layers |
| HDI |
|
|
| Tier 1-3 |
| Thickness |
|
|
| 0.6-3.2mm |
| Tolerance of Thickness |
| Thickness≥1.0mm |
| ±10% |
|
|
| Thickness＜1.0mm |
| ±0.1mm |
| Max. Dimensions |
| 1-4 Layers |
| 520×600mm |
|
|
| ≥6 Layers |
| 400×500mm |
| Panel Frame |
|
|
| ≥3mm |
| EMP |
|
|
| Support |
| CHP |
|
|
| Support |
| POFV |
|
|
| Support |
| BVCF |
|
|
| Support |
| Cut Lamination | Materials |
| Material |
| FR-4 |
|
|
| Brand |
| SYTECH、KINGBOARD、GDM etc. |
|
|
| Level |
| A |
|
|
| TG |
| 130℃/150℃/170℃ |
|
|
| CTI |
| ≥175V |
|
|
| Breakdown Voltage |
| ≥4000V |
|
|
| Fire Prevention |
| UL-94 V0 |
| Drill | Circle Hole |
| Electro Drill |
| 0.15mm≤hole dia.≤6.35mm |
|
|
| Laser Drill |
| 0.075mm≤hole dia.≤0.15mm |
| Slot Hole |
| ETH |
| ≥0.50mm |
|
|
| NETH |
| ≥0.80mm |
| Half Hole |
| Diameter |
| ≥0.5mm |
|
|
| Spacing |
| ≥0.9mm |
| Tolerance of Hole Site |
|
|
| ±0.075mm |
| Tolerance of Diameter |
| PTH（Standard） |
| ±0.075mm |
|
|
| PTH（PFH） |
| ±0.05mm |
|
|
| NPTH |
| ±0.05mm |
|
|
| Hole Slot |
| ±0.1mm |
| Plating | Material Copper Thickness（OZ） |
| Inner Layer |
| 0.5-4 |
|
|
| Outer Layer |
| 1~4 |
| Plating Copper Thickness（μm） |
|
|
| ≥20 |
| Hole Copper Thickness（μm） |
| Through Hole |
| Standard≥20 |
|
|
| Mechanical Blind Hole |
| Standard≥20 |
| Electroplating of borehole（μm） |
| dimple |
| ≤10 |
| Photolithography | Tolerance of Line Width |
|
|
| ±20% |
| Inner Layer min. width/spacing |
| 0.5OZ（18μm） |
| ≥2.5/3.0 mil |
|
|
| 1OZ（35μm） |
| ≥3.0/3.0 mil |
|
|
| 2OZ（70μm） |
| ≥5.5/5.5 mil |
| Outer Layer max. width/spacing |
| 1OZ（35μm） |
| ≥3.0/3.0 mil |
|
|
| 2OZ（70μm） |
| ≥5.5/5.5 mil |
| Net min. width/spacing |
| 1OZ（35μm） |
| ≥6.0/6.0 mil |
|
|
| 2OZ（70μm） |
| ≥10/10 mil |
| Min. welding hoop |
| 1OZ（35μm） | TH | ≥3.5mil |
|
|
|
| CH | ≥8mil |
|
|
| 2OZ（70μm） | TH | ≥4.5mil |
|
|
|
| CH | ≥10mil |
| BGA pad dia. |
| SnPb |
| ≥10mil |
|
|
| Immersion gold |
| ≥8mil |
| Min. BGA pad pitch |
|
|
| ≥0.45mm |
| Impedance |
| ＞50Ω tolerance |
| ±10% |
|
|
| ≤50Ω tolerance |
| ±5Ω |
|
|
| Single-Ended |
| ≤75Ω |
|
|
| Differential |
| ≤150Ω |
| Solder Mask | Color |
|
|
| Green, Blue, Red, Yellow, White, Black, Matte Black |
| Solder mask thickness |
|
|
| 15±10μm |
| Solder Mask Opening (SMO) |
|
|
| ≥1.5mil |
| Solder Mask Bridge |
|
|
| Green：≥3.5mil |
|
|
|
|
| White/Black：≥5mil |
|
|
|
|
| Other Color：≥4mil |
| Hole Type |
|
|
| Via Covering |
|
|
|
|
| Via Openning |
|
|
|
|
| Via Filling |
|
|
|
|
| Via Resin Filling |
| Filling |
| Hole diameter |
| 0.2mm＜dia.≤0.45mm |
| Silkscreen | Silkscreen |
| Color |
| White, Black |
| Etching |
| Width/Height |
| ≥4mil/25mil |
| Silkscreen |
| 1OZ（35μm） | Width/Height | ≥5mil/30mil |
|
|
| 2OZ（70μm） | Width/Height | ≥7mil/42mil |
|
|
| 3OZ（105μm） | Width/Height | ≥12mil/50mil |
| Ink jet |
| Width/Height |
| 0.075mm/0.6mm |
| Surface Finish | Surfacing |
|
|
| HAL/HASL, Immersion gold, OSP, Plating gold |
|
|
|
|
|
|
| Coating Thickness (μin) |
| Immersion gold | Nickel | 100-200 |
|
|
|
| Gold |
|
|
|
| Plating Nickel gold | Nickel | 120-200 |
|
|
|
| Gold |
|
| Immersion gold |
| Minimum spacing between gold fingers and pads |
| ≥5mil |
| Forming | Form tolerance |
|
|
| ±0.15mm |
| Trace to board edge |
| CNC Milling |
| ≥0.20mm |
| V-cut |
| Angle |
| 30°、45°、60° |
|
|
| Max. V-cut |
| ≤30 |
|
|
| External width |
| 60mm≤宽度≤480mm |
|
|
| Excess thickness |
| 0.25-0.5mm |
|
|
| Tolerance |
| ±0.1mm |
| Beveled edge of Finger |
| Beveled plate thickness |
| 0.8-2.0mm |
|
|
| Beveled edge Dimension | Length | 30-280mm |
|
|
|
| Height | ≥40mm |
|
|
| Beveled edge angle |
| 20°30°45°60° |
|
|
| Tolerance |
| ±5° |
|
|
| Deepth tolerance |
| ±0.15mm |
| E-Testing | Testing Point |
| Flying probe testing |
| Any |
|
|
| Testing fixture |
| ＜14000 points |
| IC&BGA dimension |
|
|
| ≥8mil |
| FQC | Warpage |
|
|
| 0.75% |
| Others | Finishing |
| Single pieces |
|
|
|
|
| Panels |
|
|
| Panelization |
| 0-Gap Panelization |
|
|
|
|
| Panelization Gap |
| Gap＞1.6mm |
|
|
| Stamp Hole Panelization |
|
|
| Shipping Report |
| Standard Report |
|
|
|
|
| Slice Report |
|
|
|
|
| Impedance Test Report |
|
|
