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Subject	Type（FR-4）			Manufacturing Capability
Finished Product	No. of Layer			1-40 Layers
	HDI			Tier 1-3
	Thickness			0.6-3.2mm
	Tolerance of Thickness	Thickness≥1.0mm		±10%
		Thickness＜1.0mm		±0.1mm
	Max. Dimensions	1-4 Layers		520×600mm
		≥6 Layers		400×500mm
	Panel Frame			≥3mm
	EMP			Support
	CHP			Support
	POFV			Support
	BVCF			Support
Cut Lamination	Materials	Material		FR-4
		Brand		SYTECH、KINGBOARD、GDM etc.
		Level		A
		TG		130℃/150℃/170℃
		CTI		≥175V
		Breakdown Voltage		≥4000V
		Fire Prevention		UL-94 V0
Drill	Circle Hole	Electro Drill		0.15mm≤hole dia.≤6.35mm
		Laser Drill		0.075mm≤hole dia.≤0.15mm
	Slot Hole	ETH		≥0.50mm
		NETH		≥0.80mm
	Half Hole	Diameter		≥0.5mm
		Spacing		≥0.9mm
	Tolerance of Hole Site			±0.075mm
	Tolerance of Diameter	PTH（Standard）		±0.075mm
		PTH（PFH）		±0.05mm
		NPTH		±0.05mm
		Hole Slot		±0.1mm
Plating	Material Copper Thickness（OZ）	Inner Layer		0.5-4
		Outer Layer		1~4
	Plating Copper Thickness（μm）			≥20
	Hole Copper Thickness（μm）	Through Hole		Standard≥20
		Mechanical Blind Hole		Standard≥20
	Electroplating of borehole（μm）	dimple		≤10
Photolithography	Tolerance of Line Width			±20%
	Inner Layer min. width/spacing	0.5OZ（18μm）		≥2.5/3.0 mil
		1OZ（35μm）		≥3.0/3.0 mil
		2OZ（70μm）		≥5.5/5.5 mil
	Outer Layer max. width/spacing	1OZ（35μm）		≥3.0/3.0 mil
		2OZ（70μm）		≥5.5/5.5 mil
	Net min. width/spacing	1OZ（35μm）		≥6.0/6.0 mil
		2OZ（70μm）		≥10/10 mil
	Min. welding hoop	1OZ（35μm）	TH	≥3.5mil
			CH	≥8mil
		2OZ（70μm）	TH	≥4.5mil
			CH	≥10mil
	BGA pad dia.	SnPb		≥10mil
		Immersion gold		≥8mil
	Min. BGA pad pitch			≥0.45mm
	Impedance	＞50Ω tolerance		±10%
		≤50Ω tolerance		±5Ω
		Single-Ended		≤75Ω
		Differential		≤150Ω
Solder Mask	Color			Green, Blue, Red, Yellow, White, Black, Matte Black
	Solder mask thickness			15±10μm
	Solder Mask Opening (SMO)			≥1.5mil
	Solder Mask Bridge			Green：≥3.5mil
				White/Black：≥5mil
				Other Color：≥4mil
	Hole Type			Via Covering
				Via Openning
				Via Filling
				Via Resin Filling
	Filling	Hole diameter		0.2mm＜dia.≤0.45mm
Silkscreen	Silkscreen	Color		White, Black
	Etching	Width/Height		≥4mil/25mil
	Silkscreen	1OZ（35μm）	Width/Height	≥5mil/30mil
		2OZ（70μm）	Width/Height	≥7mil/42mil
		3OZ（105μm）	Width/Height	≥12mil/50mil
	Ink jet	Width/Height		0.075mm/0.6mm
Surface Finish	Surfacing			HAL/HASL, Immersion gold, OSP, Plating gold

	Coating Thickness (μin)	Immersion gold	Nickel	100-200
			Gold
		Plating Nickel gold	Nickel	120-200
			Gold
	Immersion gold	Minimum spacing between gold fingers and pads		≥5mil
Forming	Form tolerance			±0.15mm
	Trace to board edge	CNC Milling		≥0.20mm
	V-cut	Angle		30°、45°、60°
		Max. V-cut		≤30
		External width		60mm≤宽度≤480mm
		Excess thickness		0.25-0.5mm
		Tolerance		±0.1mm
	Beveled edge of Finger	Beveled plate thickness		0.8-2.0mm
		Beveled edge Dimension	Length	30-280mm
			Height	≥40mm
		Beveled edge angle		20°30°45°60°
		Tolerance		±5°
		Deepth tolerance		±0.15mm
E-Testing	Testing Point	Flying probe testing		Any
		Testing fixture		＜14000 points
	IC&BGA dimension			≥8mil
FQC	Warpage			0.75%
Others	Finishing	Single pieces
		Panels
	Panelization	0-Gap Panelization
		Panelization Gap		Gap＞1.6mm
		Stamp Hole Panelization
	Shipping Report	Standard Report
		Slice Report
		Impedance Test Report

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