• end-to-end service • from design to product • eliminate multiple vendors • tranceable quality
• reduce project timeline • without transfer from vendors • 1~2 weeks for prototype • 2~3 weeks for mass batch
• own factory manufacturing • experienced components sourcing • low cost-long cooperation • competitive prototype cost
• high product quality • prompt respond and action • 1V1 online service • good after sale service
• 1-32 layers, HDI 3, 10 oz Cu • KB/Shengyi/Rogers/IPC Class 3 • From 24 hours
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• PCB, components & assembly • 0.25mm pitch BGA/QFN, Class 3
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• Up to 6 layers • Adhesive/adhesiveless RA/ED • Stiffeners, EMI shielding
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• Rigid: 2-32L, Flex: 1-6L • Support complex stack-ups • Blind/buried vias, Via-in-pad
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• Aluminum, copper, iron, etc • 1-6 layers, single/double-sided • Pedestal/coin, up 1~3W
Quote Now• Global sourcing capabilities • Mature supply chain • Competitive pricing & lead times • 100% genuine guarantee
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Building a one-stop service ecosystem for the electronics and machinery industry to support global hardware innovation
160+
1000+
99.5%
150000+
EN / USD
